Tin plating round copper wire

Adopt advanced retreat plating machine production, choose conform to the requirement of national standard GB/T 3953-3953 of naked round copper wire, tin tin chosen conform to the requirement of national standard GB/T728-1998 a number of pure tin, the use of advanced vacuum tube type continuous annealing hot dip tin plating process.Tin plated copper conductor surface can prevent bare copper wire, direct contact with rubber produces chemical reaction, which in turn lead to resistance increases, the ageing phenomenon such as lower mechanical strength.So tin plated copper wire with small resistance, good resistance to oxidation, the advantages of easy to solder.Tin plating round cable specialist is responsible for monitoring the whole process of various parameters, ensure the quality of the products and performance are in accordance with the standards set by the national GB/T491-2009.
Application: tinned copper wire is mainly used for rubber insulated cable for mine, soft wire, cable and Marine cable wire core, and used as insulated wire and cable shielding layer and outside brush wire, etc.
Product features:
1, tin plated copper wire has excellent weldability.
2, as the change of time, still keep good weldability, can be stored for a long time.
3, surface smooth, bright and moist.
4, performance is stable and reliable, to ensure the high quality and high yield.
Scope of application:
1, resistance and capacitance;
2, photosensitive element, diode and crystal and sensors;
3, jumpers and other electronic components;Wire, cable manufacturers preferred products;
Product performance:
1, the tensile strength, or 245 kg/mm bent over and over again: p 4 times
2, extension ratio: 15% or greater (or according to customer's requirement)
3, tin plating thickness: thin plating: plating in the 1.5 2.5 mm, 3.5-4.0 mm thick plating: more than 4 mm
4, wire diameter, allowable deviation plus or minus 0.01 mm
5, appearance: surface light, colour and lustre is uniform, no tin, shading, crack, burr, yellowing, tin tumor
6, solderability: 250 + 2 ℃ lead-free tin dipped 2 + / - 0.5 s, more than 95% of the new tin can be attached to
7, aging test: 200 + 5 ℃ bake for 1 hour, no yellow and black phenomenon
8, continuity, hydrochloric acid, sodium polysulfide solution experiments three cycle, no dew copper, black spots
9, binding force, the winding 6 circle above in saturated sodium polysulfide leaching test, no crack, black.