Sn99Ag0.3Cu0.7 High Melting Ba

BBIEN LF-04 Sn99Ag0.3Cu0.7 high quality melting solder barSn99Ag0.3Cu0.7 solder bar descriptionBBIEN LF-04 SACX0307(Sn99Ag0.3Cu0.7) is a antioxidant lead-free alloy wave soldering bar that contains 99 % tin, 0.3% silver, and 0.7% copper. This alloy falls under the JEIDA recommendation for lead-free soldering. When used in wave soldering, BBIEN’s SACX0307 bar solder offers far superior fluidity as compared to other alloys and makes of bar, resulting in excellent flow. BBIEN’s SACX0307 tin-silver-copper alloy bar solder also produces less dross than other bar solder, wets well, provides superior joint strength, and offers superior copper dissolution rates. BBIEN’s SACX0307 bar solder is alloyed in the proprietary Electropure™ method that results in a low drossing, high wetting solder. The Electropure process reduces suspended oxides in the solder, thus reducing drossing, improving flow and reducing bridging during soldering. SACX0307 may be used with most existing equipment, processes, coatings, and flux chemistries.Technical DatasheetSpecificationsProduct TypeSolder bar Sn99Ag0.3Cu0.7BrandBBIENMaterialTin-Silver-Copper alloyCompositionSn,Ag,CuMelt point227 degree CelsiusUsingMatch with solder flux for wave solderingApplicationmetal soldering,electronicsDensity (g/m^3)7.35Bar/Stick size32*2.0*45pxWeightAppox 0.9kg/pcTypeHigh temperature solder barPlace of originMade in ChinaCertificateSGSKeywordTin silver copper lead free oxidation resistance solder barSACX0307 lead free solder barSolder bar SACX0307BBIEN is one of suppliers who have this difficult technical to make this kind of high temperature BBIEN is one of suppliers who have this difficult technical to make this kind of high temperature oxidation resistance solder bar.We also got the approval of RoHS and REACH for lead free solder bar ISO9001 system of management and testing system reach the international standard.Temperature Requirements: Wave soldering pot temperature of 265° -270°C (509° -518°F). Refer to the flux data sheet for specific pre-heat instructions.Physical Properties:Specific Gravity: Approx. 7.33~7.40 Melting Temperature: 217° -227°C metal PropertyUnitsVaculoy Sn99Ag0.3Cu0.7SolidusCelsius217LiquidusCelsius228HardnessHV14.1Densityg/cc7.33Elongation at failure (%)Mean21.8Std Dev8.8Thermal Expansion Coefficient-5(30 - 100C)/C x 101.79-5(100 - 150C)/C x 102.30Silver Content%0.3 +0.15/-0.05Copper Content%0.70 +/-0.1Lead Content%Max 0.07%Recommended Process SettingsWave ConfigurationProcess ParameterSuggested Process SettingsSingle WavePot temperature255 - 265°C (491 - 509°F)Conveyor speed1.0 - 1.5 m/min (3.3 - 5 ft/min)Contact time2.3 - 2.8 secondsWave Height1/2 to 2/3 of board thicknessDross removalOnce per 8 hour run timeCopper CheckEvery 8,000 boards until 40,000Dual WavePot temperature255 - 265°C (491 - 509°F)Conveyor speed1.0 - 1.5 m/min (3.3 - 5 ft/min)Contact time3.0 - 3.5 secondsWave Height1/2 to 2/3 of board thicknessDross removalOnce per 8 hour run timeCopper CheckEvery 8,000 boards until 40,000These are general guidelines which have proven to yield excellent results; however, depending upon yourequipment, components, and circuit boards, your optimal settings may be different. In order to optimize yourprocess, it is recommended to perform a design experiment, optimizing the most important variables (i.e.amount of flux applied, conveyor speed, topside preheat temperature, solder pot temperature and boardorientation, etc…).Recommended AC Tion Levels for Wave Solder Impurities  Alloy Coposition: Sn: Balance Ag: 0.3 ± 0.2 Cu: 0.7 ± 0.1Impurity ContentsPlease find below a list of recommended action levels for wave solder bath impurities. For information of specific action plans to bring your solder bath back to an acceptable condition please contact BBIEN sales office.ElementACTION Levels %NotesSnBALNo Action level.Pb0.10RoHS Directive 2011/65/EU states a maximum Lead content of 0.1%.As0.03Levels greater than 0.03% can cause de-wetting.Cu1.0SACX 0307 is tolerant to copper levels up to 1.0%, SACX 0300 copper free should be added to maintain copper levels. Levels above 1.0% may cause more bridging.Bi0.20Lead Free alloys are tolerant to Bi up to 1.0%, however if levels above0.20% are detected this indicates some contamination issues that should be investigated.Zn0.003Levels greater than 0.003% may cause increased bridging and icicling, as well as, increased drossing rates in the solder bath.Fe0.02Greater than 0.02% Iron can be an indicator of pot erosion and may cause gritty joints and the formation of FeSn2 IMC needles that can cause bridging.Ag1.0Silver levels of 4% are used in some SAC alloys, however if the levels inSACX 0307 rise above 1.0% then some investigations should be held toestablish the cause.Sb0.20Lead Free alloys are tolerant to Sb up to 1.0%, however if levels above0.20% are detected this indicates some contamination issues that should be investigated.Ni0.05Levels greater than 0.05% may start to slow wetting and may reduce hole fill.evaluate soldering performance if levels exceed 0.05%. Locate andeliminate source of high Ni levels.Cd0.003RoHS Directive 2011/65/EU states a maximum Cadmium content of 0.01%.Levels of 0.003% may cause higher level of bridging and icicling.Al0.002Levels greater than 0.002% may cause higher levels of bridging and iciclingand a greater level of surface oxidation in the solder bath.Au0.1At levels above 0.1% there may be some problems with joint strength.Features&BenefitsBenefits:Lowers Total Cost of Ownership due to the lower material cost,high yields and low dross generation.Gives very good solderability due to the fast wetting speed.Gives very good drainage and hence lower levels of bridges due to the formulation containing Silver.Delivers good performance across a range of flux technologies.The proprietary Vaculoy process is a highly effective method for removing included oxides from solder.This is extremely important because included oxides generate excessive drossing and increase the viscosity of the solder.Solder with higher viscosity can result in increased soldering defects(i.e.solder bridging).Features:· Copper Dissolution Rate–Low copper dissolution rate,reduced solder-pot maintenance and improved bath life.· Wetting Speed–0.75 seconds typical wetting speed compares to SAC0307 at 0.65 sec and superior to Sn99.3/Cu0.7 base alloys at 1.0 sec.· Flat Uniform Deposits–less thickness variance than Sn63/Pb37· Lowers Total Cost of Ownership due to the lower material cost,high yields and low copper dissolution rates.· Gives very good solderability due to the fast wetting speed.· Compatible with all assembly SAC(Sn/Ag/Cu)based alloys SACX,SAC305 etc.· Excellent shelf life and ultimate solderability–will improve hole fill on multiple reflow boards.Melting Point(217°C-228°C)Excellent Fatigue Resistance–Compatible with all Flux TypesExcellent Solder Joint ReliabilityApplicationUsual electronic component,PCB soldering;copper plate boards.The use of BBIEN LF-04 Sn99Ag0.3Cu0.7(SACX0307)wave soldering bar as wave solder requires a solder bath temperature of approx.225-270°C;this alloy can also be processed at higher temperatures for selective soldering.The use of inert gas means a significant extension of the process window.The wetting of the solder is made easier and on exit from the wave,no excess solder remains attached to the components.Storage and Shelf LifeThe shelf life of solder wire is based on the chemistry of the flux core and the protective alloy covering of the wire.When stored in a dry,non-corrosive environment between 10°C-40°C(50-104°F),the shelf life of wire may be nearly indefinite.The expiration date determined by the date of manufacture printed on the product and Certificate of Analysis will represent the manufacturer’s warranty period which is the time frame where in BBIEN will replac defective product.Low temperature Sn-Bi and Sn-Bi-Ag solder wires with alloys wire have a 2 year warranty from the date of manufacture.All other alloys have a 2 year warranty from the date of manufacture.Packing informationBBIEN LF-04 Sn99Ag0.3Cu0.7(SACX0307)silver solder bar is available in 0.82~0.93 trapezoidal bars to easily distinguish it from traditional rectangular tin-lead bars.Checkout and payment:After Auction Close,you can go ahead and checkout with bank system.We do not offer combine payment and discount, since items might dispatch from our different warehouse.Make sure you file correct shipping address during checkout,and you will be guid to Payment link.You will be able to pay through our bank account by 100%T/T advanced L/C at sight is acceptabShipping way:We have a cooperation with big express company,such as CHINA POST(EMS),TNT,DHL,FEDEX,UPS;We also connect with SF express inland market,while the delivery time is short.During shipping,we will follow up within 24 hours,and report the relevant process scheduling for you.Exported SituationBBIEN LF-04 SACX0307 lead free silver solder bar have been exported to Korea,Autralia,Japan,Canad,Saudi-Ara,UAE.We are highly appreciated your kindly inquiry and feedback to BBIEN,and cooperate in the future.Products Photos