Dispensing SMT Red Glue Epibon

Product DetailsDispensing SMT red glue epibond adhesives 30ml tubeDescription of dispensing epibond adhesivesBBIEN’s dispensing SMT red glueis a kind of single resin adhesive .Good stable curing shapes without stringing, overflowing and slumping are achieved even at a super high speed and long time printing. Because of the "rarely cutting" bonding strength and very low humidity absorption, it is specially fit for SMT technology of porous printing in common temperature. Its shape can easily be controlled .We can not only expect a long-term preservation stability but also the excellent thermal resistance and electrical properties. Moreover it is good for environment protection for its safety, no solvent and no smelling. Feature of BBIEN dispensing 30ml red glue adhesive- For Dispensing Applications,Fast Curing and Non-Stringing Formula- Good for High Speed Placement Equipment- High Shear Strength- Available in Industry Standard Sizes; Non-REACH Compliant· Dispense, print and pin transfer application.· High-visibility red or yellow options.· Room temperature stability, 6-month room temperature shelf life.· Non slumping and non stringing.· Screen printable with BBIEN CUT laser stencils to SMD adhesive guidelines.BBIEN dispensing SMT surface mount adhesives offer excellent performance for all print and dispensing· Non-slumping and non-stringing.· Room temperature stability.· Dispense, print and pin transfer application.· Consistent dot profile and fact curing.· High-visibility red or yellow options.BBIEN dispensing Epibond Surface Mount Adhesives Typical Cure ProfileA correct thermal profile is critical to ensure that the adhesive achieves maximum mechanical strength and a homogeneous cure:· Ensure the material is heated to the correct temperature for the specific time.· maximum thermal ramp rate is 1.5 to 2.0°C/second to ensure a homogeneous cure.Printed Adhesive · Sales/support in every major electronics geographic market· Local and consistent technical support regionally and globally· Consistent product performance globallyPart of physical feature and specificationProductsAppearanceviscosityDensityShear StrengthCure TemperatureCure SpeedmPa.sg/cm3mpa°CsRed GlueRed280,000mPa·S(280,000cps)1.3114.6105120-150l  Treating condition:85℃×85%RH×DC50V×1000hrs. l  JIS Z3197 Measured at comb electrode model II (G10) Specification:       TechnologyEpoxyChemical TypeEpoxyAppearance (uncured)Red viscous gelComponentsOne component - requires no mixingCureHeat CureApplicationSurface Mount AdhesiveKey SubstratesElectronic components to printed circuit boards.Other Application AreasSmall Parts BondingDispense MethodDispensing processingWet StrengthHighDot ProfilePeaked                ItemSMT Red Glue adhesive CompositionEpoxy resin adhesiveAppearanceTacky Paste/red-coloredSpecific gravity1.31Viscosity at 25℃,5rpm280,000mPa·S(280,000cps)Thixotropy index6.8(1rpm/10rpm)Adhesive Strength  2125CMini-mold trSOP·IC 16P                              44N(4.5kgf)0.2mgr twin45N(4.6kgf)0.3mgr twin92N(9.4kgf)0.8mgf single×2Electric PropertyVolume resistanceInsulation resistanceInitial valueAfter treating*Dielectric constantDielectric loss tangent3.6×1016Ω·cm    JIS K69111.2×1014Ω        JIS Z31971.2×1012Ω             3.12/1MHZ      JIS K69110.012/1MHZ     JIS K6911Preservation condition3℃~10℃的To be strictly kept at 3℃ ~10℃ in refrigeratorMain contentMain Epoxy resin and some(adhesive agent,wetting agent and surfactant…Package style for dispensing BBIEN SMT red glue adhesivePackage stylesContentsPack. UnitExport outer packingsyringe packing30mlPcs.100pcs per cartonFeatures1)Much lower temperature curing is aimed at amd is practically possible.2)Very good stable curing shapes without stringing and slumping are achieved at super high speed dispensing and very amall dots.3)stable adhesive strength can be obtained with a variety of SMD.4)Long-term preservation stability is expected.5)High heat-resistivity and excellent electric properties are possessed.6)Usable for screen printing.Direction for use 1. After storage in a refrigerator the adhesive must be allowed to equilibrate to room temperature before use, typically 12 hours.2. Avoid cross contamination with other epoxy or acrylic adhesives by ensuring dispense nozzels, adapters etc. are thoroughly cleaned.3. The quantity of adhesive dispensed will depend on the dispense pressure, time, nozzle size and temperature.4. These parameters will vary depending on the type of dispensing system use and should be optimized accordingly.5. Bath temperature should ideally be controlled at a value between 25°C-30°C, 50%RH for optimum results. Under these conditions product will remain dispensable in the tray for at least 2 to 3 days.6. Uncured adhesive can be cleaned from the board with isopropanol, MEK or glycol ether blends such as Prozon.CURE SPEED VS. TEMPERATUREThe following graph shows the rate of torque strength developed with time at different temperatures. These times are defined from the moment the adhesive reaches cure temperature. In practice, total oven time may be longer to allowfor heat up periodWarning○Products shelf life: 6Months.○Store adhesive in a refrigerator keeping the temperature at 5±3℃ ○This product may cause skin irritation to sensitive personnel.○In case Seal-glo DTK-L978 gets in touch with skin,wash it thoroughly with soap and water.○In case of eye contact,wash out with clean water and consult a medical doctor immediately.REWORKINGOnce cured,BBIEN dispensing epibond adhesives can be removed from a printed circuit board by heating the board to approximately 80°C (176°F to 185oF). When the temperature of the surface mount component reaches 80°C (176°F), the adhesive will be soft enough to permit component removal using a "lift and twist" method.CLEANINGUncured adhesives can be easily removed from printed circuit boards, screens or stencils using,isopropyl alcohol, acetone, NMP and a wide variety of other solvents and cleaning fluids. BBIEN Advanced Materials is constantly working with manufacturers of solvents and cleaning fluids to test and identify new materials that meet the needs of our customers. For an updated list of suggested cleaning materialsApplication :component epoxy resin adhesivesEpoxy 1-component adhesives are heat curing and primarily used when high shear strength or high crash-resistance is required, as well as ease of working.Note:Curing  conditionntRecommended curing condition:Over 60 sec after PCB’s surface temperature has reached 150℃.or over 90 sec after PCB’s surface temperature has reached 120℃.When the higher curing temperature and the longer curing time,the stronger adhesive strength can obtained.We would suggest you to search out an optimum curing condition,for the temperature exerterd on the adhesive may occasionally vary according to the size,material,etc.of component parts mounted on PCBs.Curing condition○Recommended curing condition: Over 60 sec after PCB’s surface temperature has reached 150℃.or over 90 sec after PCB’s surface temperature has reached 120℃.○When the higher curing temperature and the longer curing time, the stronger adhesive strength can obtained. We would suggest you to search out an optimum curing condition, for the temperature is different on the adhesive may occasionally vary according to the size,material,etc.of component parts mounted on PCBs.How to use Red glue adhesive○Adhesive should be preserved in refrigerator (below 5±3℃) to keep on its quality.○Before processing, the adhesive should be taken out from the refrigerator for de-freezing about a few hours until it reaching the room temperature.○The bottom of printing screen should be cleaned timely for good printing shape.○Toluene or ethyl acetate is possible to use for cleaning up this adhesive.Health & Safety:This product, during handling or use, may be hazardous to health or the environment. Read the Material safety Data Sheet and warning label before using this product.Consult the MSDS for all safety information. The most recent version of the SDS is available from BBIEN.Inhalation of the flux solvent and volatilized activator fumes, which are generated at soldering temperatures, may cause headaches, dizziness and nausea. Suitable fume extraction equipment should be used to remove the flux from the work area. An exhaust at the exit end of the wave solder machine may also be needed to completely capture the fumes. Observe precautions during handling and use.Suitable protective clothing should be worn to prevent the material from coming in contact with skin and eyes.Exported countries:Our SMT red glue adhesive have been exported to Iran,Korea, Turkey,America,Morocco,... We are appreciated your kindly inquiry or cooperate with you,if you are interested in our products.Products Phtos