Quick Detail :
1. Type : Pcb
2. Material : Rogers
3. Layer : Multilayer
4. Products Size :12*4 cm
5. Permittivity : 3
6. Surface finish : Immersion gold
Features:
1. Rogers pcb multilayer pcb with high frequency can improvide the products quality ,with high techolonogy treatment improve the life cycle of the products .
2. Immersion gold surface finish make the pcb 's conductive performance enhancements.
3. Multilayer pcb design ,the precision of the pcb improves much more better .
4. Low dielectric : 3 dielectric conductivity much more precision .
Description :
RO3003™ high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications. This family of products was designed to offer exceptional electrical and mechanical stability at competitive prices.
RO3003 excellent stability of dielectric constant over temperature including the elimination of the step change in dielectric constant, which occurs near room temperature with PTFE glass materials. Additionally, RO3003 laminates exhibit a low dissipation factor of 0.0013 at 10 GhZ.
Typical Applications:
- Automotive radar
- RF Couplers
- Cost sensitive aerospace and defense applications
- GPS Antennas
Production Description :
XCE PCB technical specifications | ||
Annual stock Material | Rogers,Taconic,Arton,Isola,F4B,TP-2.FR-4,High TG,Halogen free | |
Layer No. | 1~16 | |
Min board thickness |
2 layer0.2mm 4 layer0.4mm 6 layer 0.6mm 8 layer 0.8mm 10 layer 1.0mm |
|
Max panel size | 508*610mm | |
Board thickness tolerance | T≥0.8mm±8%.,T<0.8mm±5% | |
Wall hole copper thickness | >0.025mm(1mil) | |
Finished hole | 0.2mm-6.3mm | |
Min line width | 4mil/4mil(0.1/0.1mm) | |
Min bonding pad space | 0.1mm(4mil) | |
PTH aperture tolerance | ±0.075mm(3mil) | |
NPTH aperture tolerance | ±0.05mm(2mil) | |
Hole site deviation | ±0.05mm(2mil) | |
Profile tolerance | ±0.10mm(4mil) | |
Board bend&warp | ≤0.7% | |
Insulation resistance | >1012Ωnormal | |
Through-hole resistance | <300Ωnormal | |
Electric strength | >1.3kv/mm | |
Current breakdown | 10A | |
Peel strength | 1.4N/mm | |
Soldmask regidity | >6H | |
Thermal stress | 288℃20Sec | |
Testing voltage | 50-300V | |
Min buried blind via | 0.2mm(8mil) | |
Outer copper thickness | 1oz-5oz | |
Inner cooper thickness | 1/2 oz-4oz | |
Aspect ratio | 8:1 | |
SMT min green oil width | 0.08mm | |
Min green oil open window | 0.05mm | |
Insulation layer thickless | 0.075mm-5mm | |
Taphole aperture | 0.2mm-0.6mm | |
Special technology | Indepedance,Blind buried via,thick gold,aluminum PCB | |
Surface finish | HASL,Lead free HASL,Immersion Gold, Immersion Tin, Immersion Silver,OSP ,ENIG ,Golden finger,Blue glue,Gold plating |
Competitive Advantage:
1) With UL,ROHS,ISO,IPC
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .