Thick Film Ceramic Substrate

Loaded with vast industrial knowledge and expertise, we have emerged as a major Manufacturer of Thick Film Ceramic Substrate in Wuhan, Hubei, China.
Folysky Technology uses free abrasive lapping processes to provide flatness, parallelism, thickness identity, and surface finishes to extremely demanding tolerances.
In the free abrasive machining process, an abrasive (various compounds) mixed into the selected slurry is applied to a lap. The work part is placed on top of the lap in fixtures and both the lap and work plates are moving. This creates the cutting action/material removal at a controlled rate. Using various methods and unique processes, Centerline can finish pieces without introducing stresses and heat damage associated with other processes, such as grinding.
The selection of abrasive, pressure, speed of machine and shape of the lap all play a critical role in the outcome of your finished product. Using SPC processes, the controls at Centerline Technologies will provide you with a repeatable product from one lot to the next, again and again, time after time.
Here at Centerline Technologies we use single and double sided lapping, and you can rest assured that we will recommend the processes that will benefit your product the most, and to provide the highest quality at the most economical rate.