pcb design for wifi mesh

Detailed Product Description

1.MultilayerHDI/BGA PCB 
2.PCB layout, PCB design; 
3.Make high difficulty PCB 
(1 to 38 layers) 
4: PCB assembly; 

Specifications

PCB electronic contract manufacturing 
1.PCB Layout,PCB design 
2.Make high difficulty PCB(1-38 layers boards) 
3.ISO 9001

PCB electronic contract manufacturing     

1.PCB Layout,PCB design

2.Make high difficulty PCB(1-38 layers boards)

3.offer all Electric components

4.ISO9001/TS16949/ROHS

5.PCB delivery time:5-10 days; PCBA delivery time:20-25 days

 

Welcome to XingDa Electric Technology Co.,Ltd

Xindaxing Electric Technology Co.,LTd 

 

We are professional  manufacturer in  various PCB and PCBA with many years experience,We can provide a reasonable price with high quality products.

 

 XingDa who can provide a full set of service.such as below:

 

* 1. PCB layout, PCB design

* 2: Make high difficulty PCB(1 to 38 layers)

* 3: Provide all Electronic component

* 4: PCB assembly

* 5: Write programs for clients

* 6: PCBA/finished product Test. etc.

 

 1.PCB Specification detail. 

 

	Item	Specification
1	Numbr of Layer	1-38Layers
2	Material	FR-4,FR2.Taconic,Rogers, CEM-1 CEM-3,ceramic , crockery Metal-backed Laminate
3	Finish Board Thickness	0.2mm-6.00 mm(8mil-126mil)
4	Minimun Core Thickness	0.075mm(3mil)
5	Copper Thickness	1/2 oz min;12 oz max
6	Min.Trace Width & Line Spacing	0.075mm/0.1mm(3mil/4mil)
7	Min.Hole Diameter for CNC Driling	0.1mm(4mil)
8	Min.Hole Diameter for punching	0.9mm(35mil)
9	Biggest panel size	610mm*508mm
10	Hole Positon	+/-0.075mm(3mil) CNC Driling
11	Conductor Width(W)	0.05mm(2mil)or;+/-20% of original artwork
12	Hole Diameter(H)	PTH L:+/-0.075mm(3mil);Non-PTH L:+/-0.05mm(2mil)
13	Outline Tolerance	0.125mm(5mil) CNC Routing;+/-0.15mm(6mil) by Punching
14	Warp & Twist	0.70%
15	Insulation Resistance	10Kohm-20Mohm
16	Conductivity	<50ohm
17	Test Voltage	10-300V
18	Panel Size	110×100mm(min);660×600mm(max)
19	Layer-layer misregistration	4 layers:0.15mm(6mil)max;6 layers:0.25mm(10mil)max
20	Min.spacing between hole edge to circuity pqttern of an inner layer	0.25mm(10mil)
21	Min.spacing between board oulineto circuitry pattern of an inner layer	0.25mm(10mil)
22	Board thickness tolerance	4 layers:+/-0.13mm(5mil);6 layers:+/-0.15mm(6mil)
23	Impedance Control	+/-10%
24	Different Impendance	+-/10%

 

2.Details for PCB Assembly

Technical

1).Professional surface mounting and through hole soldering technology;

2).Various sizes,like 1206,0805,0603 components SMT  technology;

3).ICT(In Circuit Test),FCT(Functional Circuit Test)  technology;

4).Nitrogen gas reflow soldering  technology for SMT;

5).High standard SMT&Solder Assembly line;

6).High density interconnected board placement technology capacity.

 

Quote requirement

 

1).The detailed files(Gerber files,specification and  BOM);

2).Clear pictures of PCBA or samples for us;

3).PCBA Test method.