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| Technical data Low temperaturehot melt glue stick/powder Procedure：It can be used for glue gun，hot melt glue machine, can be stciked on plywoods、paper products、fibers、leathers、metals,plastics,special for export and low temperature area ，low temerature area uses this products, ，good bonding，not easy seperate，not break, belongs to high level products. Main component: poly resin Chill-proof：－１８℃－２５℃ Solid component: 100% Softness point： ７5℃±5℃ Brookfield Vocosity 180℃……………………12500±1500mpas Spec: Dim: (big)11.3±0.3Χ250mm Dim (small) 7.5 ±0.3 Χ250mm Special Dim.: 1５±0.3Χ300mm The time of solidification: 10-13sec outer view: transparent stick/powder Character： non-toxic、meet enviroment requirement。middle hardness，good strengthen，middle vicosity，high bonding，easy operation。 Specification: suggest to use 60-80W hot melt glue gun or machine Storage: storage at cool area、ventile and dry area，can be storaged 12 months。 packing： carton Caution：during on working ，do not put the gun at flat 。 above data referece only, ，we suggest user to do the test in order to make sure the final data. |
