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XY690 Reactive Diluent
1. Descript ion
Chemical name: Phenyl glycidyl ether, containing phene ring and ether key and epoxy group, compared with 501 dilunet, which can eliminate the bad effect from heat when curing, so its advantage is good heat-resistance, and good corrosion-resistance. Molecular formula：C9H10O2， molecular weight：150，
Structural Formula: C6H5OCH2(CHCH2)O，
CAS Number: 122-60-1
Physical and chemical character: Colorless transparent liquid, melting point: 3.5℃,boiling point: 242.5℃,relative density: 1.1109(21.2℃),refraction rate: 1.5307(21.2℃), immiscible in water but it can be vaporized by water vapour, easy miscible in aether and phene.
2. Technical Data Sheet
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Specifications
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XY690
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Color, APHA
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≤50
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≤100
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Viscosity, mPas (25℃)
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2～6
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2～10
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Epoxide equivalent, g/eq
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147～159
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170～185
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Purity,%
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≥98.0
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-
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Hydrolyzable chloride, eq/100g
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≤0.01
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≤0.02
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Inorganic chlorine, eq/100g
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≤0.002
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≤0.005
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Moisture content %
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≤0.1
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≤0.1
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3. Application
- XY690 can be discretionarily combined with epoxy resin in proportion because of its low viscosity (only about 0.007Pa·s).
- To be used as Epoxy resin active diluent, modified m-phenylenediamine curing agent material, and in non-solvent unticorrosion coating, winding-forming.
Dosage: In general, XY690 should be 10-15% of Epoxy Resin in weight, XY690 contains epoxy group which can neutralize curing agent, so it is necessary to add the quantity of curing agent in course of using.
4. Packing
- Packed in 20 kg/barrel or 200 kg/barrel, or 1000kgs/IBC container
- Storage and transportation must conform to basic requirements of normal chemicals.
- Store in a cool, dry and well ventilated area. Keep away from ignition sources, heat and flame and sunlight.
- It is necessary to maintain insulated (tightly seal) after use, in order to avoid negative influence arousing from moisture absorption.
