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Model:CHINAFIX CF260
Solder Type:Lead Solder/Lead Free
SMD Type:Micro BGA,BGA,CSP,QFP
PCB Thickness:0.5mm~4mm
PCB Size:W50*D50mm~W440*D310mm
Heating Mode/Power(Upper):Hot-blast air / 800W
Heating Mode/Power(Bottom):Hot-blast air / 800W
Preheating Mode/Power:IR / 2200W
PCB Location Mode:Shape or Tongs
Drive Mode:Gear,Rack
Control / Adjusting Mode:Temperature control instrument
Temperature Range:Room Temperature 0~400°C
Max Power:3800W
Supply Voltage:110V/220V
Machine Dimension:720mm(L) * 620mm(W) * 410mm(H)
Weight:28KG
CF260 characteristics:
1.The hot-air part adopts exported long-life heating coil, through special insulation heating treatment, heating uniformly, long-life to use well.
2. The design of three warm areas support can fine adjust to support height, avoid welding-area to sink.
3. Upper hot-air flow can be adjusted, to different BGA chips, choose different air-flow, temperature is more accurate, not easily explosive.
4. Upper and bottom hot-air control temperature separately, it can store 10 items with 16 stages temperature curve setting-up.
5. Overtemperature protection function,over the temperature, heating coil automatic power off.
6.Be applied to welding of leaded solder and unleaded solder flexibly, and meantime offer 10 groups of common referenced curve.
7. Machincal part adopts oxidation treatment, main machine box use thickened material, to prevent shapeless at whole hog.
8. Upper heating part continues to use high-grade products' design of move by X/Y shaft, treating all kinds of shapeless chips easier.
9. Three warm areas can be controlled separately, to achieve the function of soldering and dry.
10. Complete machine construction adopts the only design of dismounting easily, exchange electric parts simply and conveniently, warranty with fast speed, machine's rate of utilization reaches the highest.
