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CHINAFIX CF280T SMD intelligent BGA chips soldering machine

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Brand: CHINAFIX
型号: CF280T
Price: Negotiable
Min.Order: 1 set
Supply
Delivery: Shipment within 3 days since the date of payment
Address: China
Valid until: 2031-11-23
Updated on: 2014-06-20 15:45
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Details
 CF280T Working Parameter
Model:Chinafix CF280T
Solder Type:Leaded/Lead Free
SMD Type:Micro BGA,BGA,CSP,QFP
PCB Thickness:0.5~4mm
PCB Size:W50*D50~W440*D310mm
Heating Mode/Power(Upper):Hot-blast air /800W
Heating Mode/Power(Bottom):Hot-blast air /800W
Preheating Mode/Power:IR /2200W
PCB Location Mode:Shape or Tongs
Driver Mode:Gear,Rack
Control/Adjusting Mode:Touch Screen + PLC
Temperature Range:Room Temperature 0~400°C
Max Power:3800W
Supply Voltage:110V/220V
Machine Dimension:720mm(L) * 700mm(W) * 570mm(H)
Machine Weight:28KG
  CF280T characteristic:
1, Touch-screen+PLC, precise temperature control, being operate easily
2, The hot-air part adopts exported long-life heating coil, through special insulation heating treatment, heating uniformly, long-life to use well.
3, The design of three warm areas' support, can fine adjust to support height, avoid welding-area to sink.
4, Upper and bottom hot-air control temperature separately, it can store 50 items with 16 stages temperature curve setting-up.
5, Overtemperature protection function,over the temperature, heating coil automatic power off.
6, Intelligent mute function, keep mute under non-working condition.
7, New type design of air outlet with mixed wind, air-out temperature uniformly.
8, Machincal part adopts oxidation treatment, main machine box use thicken material, prevent shapeless at whole hog.
9, Upper heating part continues to use high-grade products' design of move by X/Y shaft, treating all kinds of shapeless chips easier.
10, Three warm areas can be controlled separated, to achieve the function of soldering and drying.
11, Complete machine construction adopts the only design of dismounting easily, exchange electric parts simply and conveniently, warranty with fast speed, machine's rate of utilization reaches the highest.
12, Allocate vacuum attaching-pen, take down chips easily. 
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